HDI BOARDS ? HIGH DENSITY INTERCONNECT
HIGH DENSITY INTERCONNECT
High density interconnect is a PCB design technique that reduces size while keeping functionality. The technology allows engineers to cram components closer together, improving performance and reducing cost by lowering signal loss, crossing delays and other factors. It’s used in a wide range of electronic devices, including mobile phones and touch-screen devices, laptop computers, 4/5G network communications and military applications.
A high density interconnect board uses microvias, blind vias and buried vias to connect layers and reduce the overall size of the circuit. These small connections increase routing density and are made possible through the use of advanced materials and manufacturing processes.
The boards are typically smaller than standard PCBs, which saves space and allows for versatile routing. They are also more durable than traditional boards and can withstand a wide range of environmental conditions. This increased durability and efficiency makes HDI boards ideal for a variety of applications.
HDI BOARDS ? HIGH DENSITY INTERCONNECT
To make a high-density interconnect board, manufacturers start by etching the inner copper layers. Then they separate them with partially cured laminates and stack them like a book, adding layers of prepreg on the top and bottom. Then the stack-up is pressed and heated to liquify the prepreg, which then sticks the layers together. The process continues until the desired number of layers is achieved. For a board with blind and buried vias, this can take several sequential laminations.
Another advantage of HDI boards is the short time it takes for signals to travel between devices. The smaller trace width and pitch of a HDI board help to reduce the amount of inductance and capacitance, which helps to lower signal transmission times. This is a critical factor in many applications, such as wireless communication.
HDI technology has been a big boon to the electronics industry and is expected to continue to drive innovation. As the digital world becomes increasingly complex, the hardware that connects it needs to be able to keep pace. HDI allows designers to cram tiny components even closer together, which can improve the performance of their devices. The key considerations when designing a high-density interconnect circuit board include: